Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure and moderate heat, from 100°F (38°C) to 130°F (54°C), will assist the adhesive in developing intimate contact with the
bonding surface.
To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Some typical surface cleaning solvents are isopropyl alcohol or heptane.*
Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
*Note: Carefully read and follow the manufacturer’s precautions and directions for use when working with solvents. These cleaning recommendations may not be compliant with the rules of certain Air Quality Management Districts in California; consult applicable rules before use.
